發(fā)布時(shí)間：2018-06-20 12:31

  本文選題：環(huán)氧樹脂 + 氰酸酯樹脂　； 參考：《天津工業(yè)大學(xué)》2016年碩士論文

【摘要】：環(huán)氧樹脂由于其優(yōu)良的力學(xué)性能、電絕緣性能、耐腐蝕性、粘結(jié)性能及成型工藝性能等,在復(fù)合材料領(lǐng)域有著廣泛的應(yīng)用。但由于環(huán)氧樹脂存在耐熱性不足,限制了其在高新技術(shù)領(lǐng)域的應(yīng)用。本文針對(duì)環(huán)氧樹脂不足之處,用氰酸酯和六鈦酸鉀晶須對(duì)環(huán)氧樹脂E-51進(jìn)行改性,討論改性后復(fù)合材料的耐熱性能和力學(xué)性能等,得到最佳的改性方案。首先,選用微粉雙氰胺作為固化劑,制備出環(huán)氧樹脂預(yù)浸料及其復(fù)合材料,通過紅外測(cè)試分析固化劑的最佳用量,溫度對(duì)凝膠時(shí)間的影響,測(cè)定其玻璃化轉(zhuǎn)變溫度以及力學(xué)性能。當(dāng)雙氰胺用量為7%(重量)時(shí)最佳,120℃時(shí)凝膠時(shí)間為23min。復(fù)合材料的玻璃化轉(zhuǎn)變溫度為165.9℃,拉伸強(qiáng)度為362.48MPa,拉伸模量為13.70GPa,斷裂伸長(zhǎng)率為4.30%,彎曲強(qiáng)度為550.42MPa,彎曲模量為17.57GPa。其次,用雙酚A型二氰酸酯對(duì)環(huán)氧樹脂E-51進(jìn)行改性,對(duì)改性后復(fù)合材料的玻璃化轉(zhuǎn)變溫度、拉伸性能、彎曲性能以及吸濕性能進(jìn)行了測(cè)試。結(jié)果表明,氰酸酯的加入明顯提高了復(fù)合材料的玻璃化轉(zhuǎn)變溫度。當(dāng)環(huán)氧/氰酸酯質(zhì)量比為50/50時(shí),玻璃化轉(zhuǎn)變溫度為215.6℃,與未改性的環(huán)氧樹脂復(fù)合材料相比提高了49.7℃,但復(fù)合材料的拉伸和彎曲強(qiáng)度分別降低19.09%和12.05%。氰酸酯的加入可以明顯降低復(fù)合材料的吸水率,當(dāng)環(huán)氧/氰酸酯質(zhì)量比為70/30時(shí),吸水率最低。最后,將六鈦酸鉀晶須用硅烷偶聯(lián)劑KH-550處理,對(duì)氰酸酯/環(huán)氧共聚物進(jìn)行改性,研究復(fù)合材料的耐熱性和力學(xué)性能�？梢缘贸�,經(jīng)KH-550處理后,鈦酸鉀晶須與樹脂的界面相容性增加。鈦酸鉀晶須加入到復(fù)合材料中,熱分解溫度和殘?zhí)柯侍岣?拉伸強(qiáng)度和彎曲強(qiáng)度均呈現(xiàn)先增加后降低的趨勢(shì)。SEM分析表明,加入適量的鈦酸鉀晶須時(shí),具有較好的相容性,隨著鈦酸鉀晶須含量的增加,晶須在樹脂中分散性差,易于團(tuán)聚,導(dǎo)致復(fù)合材料的力學(xué)性能降低。
[Abstract]:Epoxy resin has been widely used in composite materials due to its excellent mechanical properties, electrical insulation, corrosion resistance, bond properties and molding process properties. However, the application of epoxy resin in high-tech field is limited because of its insufficient heat resistance. In this paper, epoxy resin E-51 was modified with cyanate ester and potassium hexatite whisker. The heat resistance and mechanical properties of the modified composite were discussed, and the best modification scheme was obtained. Firstly, the epoxy resin prepreg and its composites were prepared by using micro-powder dicyandiamide as curing agent. The optimum amount of curing agent and the effect of temperature on gel time were analyzed by IR test. The glass transition temperature and mechanical properties were measured. When the amount of dicyandiamide is 7% (weight), the best gelation time is 23 min at 120 鈩，

本文編號(hào)：2044267