高熱流密度LED離子風(fēng)散熱系統(tǒng)性能研究
發(fā)布時間：2018-12-23 08:52
【摘要】：隨著相關(guān)技術(shù)的飛速發(fā)展,LED的功率增長速度越來越快,產(chǎn)生的熱流密度越來越高,LED對創(chuàng)新、先進(jìn)的散熱技術(shù)的需求越來越緊迫,對散熱技術(shù)的要求也越來越高,散熱問題一直以來都是制約LED發(fā)展的關(guān)鍵因素之一。由此可見,LED急需新一代散熱技術(shù),該技術(shù)應(yīng)該具備以下優(yōu)點(diǎn):高散熱效率,小重量,小體積,低成本,低噪音,低功耗,可集成度高,沒有運(yùn)動部件等。離子風(fēng)散熱技術(shù)具備這些優(yōu)點(diǎn),很可能成為滿足LED散熱的新一代散熱技術(shù)。本文基于電暈放電理論,設(shè)計(jì)了一種離子風(fēng)發(fā)生裝置,裝置由針狀發(fā)射電極和網(wǎng)狀收集電極組成,其具備前面提到的各個優(yōu)點(diǎn),能與LED芯片高度集成,實(shí)現(xiàn)一體化封裝;同時,設(shè)計(jì)了實(shí)驗(yàn)測試平臺,對影響離子風(fēng)發(fā)生裝置性能的關(guān)鍵參數(shù)進(jìn)行了研究,重點(diǎn)研究了發(fā)射電極形狀、收集電極形狀、電極間距和工作電壓等因素對離子風(fēng)發(fā)生裝置的影響,針對散熱表面尺寸為40mm×40mm的高熱流密度LED芯片設(shè)計(jì)了離子風(fēng)發(fā)生裝置陣列,進(jìn)而設(shè)計(jì)出滿足LED芯片散熱需求的離子風(fēng)散熱系統(tǒng),同時,設(shè)計(jì)對比實(shí)驗(yàn),對比分析離子風(fēng)散熱系統(tǒng)與傳統(tǒng)強(qiáng)制風(fēng)冷散熱系統(tǒng)的散熱效果,具體研究內(nèi)容與結(jié)論如下:1.采用紫銅作為發(fā)射電極和收集電極的材料,利用激光加工設(shè)備對0.1mm厚度的紫銅板進(jìn)行激光加工,通過后期組裝制成離子風(fēng)發(fā)生裝置,使用單一變量法對網(wǎng)狀收集電極網(wǎng)格尺寸、針狀發(fā)射電極直徑和電極間距等影響因素逐一展開實(shí)驗(yàn)研究,結(jié)果表明:收集電極網(wǎng)格尺寸為1.0mm×1.0mm、發(fā)射電極直徑為0.122mm、電極間距為5mm是優(yōu)選的結(jié)構(gòu)參數(shù),實(shí)現(xiàn)的最高風(fēng)速達(dá)到2.45m/s。2.設(shè)計(jì)了一個適用于離子風(fēng)發(fā)生裝置陣列性能測試的實(shí)驗(yàn)平臺,通過控制單一變量,對離子風(fēng)發(fā)生裝置陣列縱向間距、橫向間距,以及收集電極與散熱表面夾角等關(guān)鍵參數(shù)進(jìn)行實(shí)驗(yàn)研究,實(shí)驗(yàn)結(jié)果顯示:優(yōu)選的縱向間距為6mm,優(yōu)選的橫向間距為2.64mm,收集電極與散熱表面夾角優(yōu)選值為30°,實(shí)現(xiàn)的最低溫度為50.29°C。3.分別研究了不同熱流密度、不同工作電壓等因素對LED離子風(fēng)散熱系統(tǒng)性能的影響,并設(shè)計(jì)對比實(shí)驗(yàn),對比分析離子風(fēng)散熱系統(tǒng)與傳統(tǒng)強(qiáng)制風(fēng)冷散熱系統(tǒng)的散熱效果,實(shí)驗(yàn)結(jié)果表明:在0.3752cm W熱流密度下,系統(tǒng)的散熱效果最佳,實(shí)現(xiàn)的對流換熱系數(shù)最高可達(dá)到75.56W/(3 );當(dāng)工作電壓為4.2k V時,系統(tǒng)的散熱效果良好,實(shí)現(xiàn)的對流換熱系數(shù)最高可達(dá)到66.71W/(3 );當(dāng)功耗在0-0.026W時,離子風(fēng)散熱系統(tǒng)占有絕對優(yōu)勢,實(shí)現(xiàn)的對流換熱系數(shù)最高可達(dá)到51.30W/(3 )。本文為高熱流密度LED離子風(fēng)散熱系統(tǒng)的設(shè)計(jì)、結(jié)構(gòu)優(yōu)化提供了新思路,對離子風(fēng)散熱系統(tǒng)的傳熱特性和應(yīng)用研究豐富了LED芯片熱管理的應(yīng)用體系,為以LED芯片為代表的高熱流密度芯片的熱設(shè)計(jì)提供了新方案。
[Abstract]:With the rapid development of related technology, the power of LED is increasing faster and faster, and the heat flux is becoming higher and higher. The demand of LED for innovation and advanced heat dissipation technology is more and more urgent, and the requirement for heat dissipation technology is also more and more high. Heat dissipation has always been one of the key factors restricting the development of LED. Therefore, LED is in urgent need of a new generation of heat dissipation technology, which should have the following advantages: high heat dissipation efficiency, small weight, small volume, low cost, low noise, low power consumption, high integration, no moving parts, etc. Ion wind heat dissipation technology has these advantages, and it is likely to be a new generation of heat dissipation technology to meet the LED heat dissipation. Based on the theory of corona discharge, an ion wind generator is designed in this paper. The device is composed of needle-like emission electrode and net-shaped collection electrode. It has the advantages mentioned above, and can be highly integrated with LED chip to realize integrated encapsulation. At the same time, the experimental test platform is designed to study the key parameters that affect the performance of the ion wind generator, especially the shape of the emission electrode and the shape of the collecting electrode. The effect of electrode spacing and working voltage on the ion wind generator was studied. An array of ion wind generating devices was designed for a high heat flux LED chip with a heat dissipation surface size of 40mm 脳 40mm. Then we design the ion wind heat dissipation system which can meet the demand of LED chip. At the same time, we design the contrast experiment, compare and analyze the heat dissipation effect of ion wind cooling system and traditional forced air cooling heat dissipation system. The specific research contents and conclusions are as follows: 1. Using copper as the material of emission electrode and collecting electrode, the copper plate with 0.1mm thickness was processed by laser processing equipment, and the ion wind generating device was made through the later assembly. A single variable method was used to study the influence factors such as mesh size, needle emission electrode diameter and electrode spacing. The results showed that the grid size of the collecting electrode was 1.0mm 脳 1.0 mm, the diameter of the emission electrode was 0.122 mm, and so on. The electrode spacing of 5mm is the optimal structural parameter, and the maximum wind speed is 2.45 m / s. 2. An experimental platform for measuring the performance of ion wind generator array is designed. By controlling a single variable, the longitudinal and transverse spacing of ion wind generator array is calculated. The experimental results show that the optimized longitudinal distance is 6 mm, the optimal transverse distance is 2.64 mm, and the optimum angle between the collecting electrode and the heat dissipation surface is 30 擄. The realized minimum temperature is 50.29 擄C. 3. The effects of different heat flux and working voltage on the performance of LED ion cooling system were studied, and a comparative experiment was designed to analyze the effect of ion air cooling system and traditional forced air cooling system. The experimental results show that under the heat flux of 0.3752cm W, the heat dissipation effect of the system is the best, and the highest convection heat transfer coefficient can reach to 75.56W/ (3?). When the working voltage is 4.2 kV, the heat dissipation effect of the system is good, and the highest convection heat transfer coefficient can reach 66.71W/ (3?). When the power consumption is 0-0.026W, the ion wind heat dissipation system has the absolute advantage and the highest convection heat transfer coefficient can reach 51.30W/ (3?). This paper provides a new idea for the design and structure optimization of LED ion cooling system with high heat flux. The research on heat transfer characteristics and application of ion wind cooling system enriches the application system of LED chip thermal management. It provides a new scheme for heat design of high heat flux chip represented by LED chip.
【學(xué)位授予單位】：廣東工業(yè)大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號】：TN312.8
本文編號：2389729
[Abstract]:With the rapid development of related technology, the power of LED is increasing faster and faster, and the heat flux is becoming higher and higher. The demand of LED for innovation and advanced heat dissipation technology is more and more urgent, and the requirement for heat dissipation technology is also more and more high. Heat dissipation has always been one of the key factors restricting the development of LED. Therefore, LED is in urgent need of a new generation of heat dissipation technology, which should have the following advantages: high heat dissipation efficiency, small weight, small volume, low cost, low noise, low power consumption, high integration, no moving parts, etc. Ion wind heat dissipation technology has these advantages, and it is likely to be a new generation of heat dissipation technology to meet the LED heat dissipation. Based on the theory of corona discharge, an ion wind generator is designed in this paper. The device is composed of needle-like emission electrode and net-shaped collection electrode. It has the advantages mentioned above, and can be highly integrated with LED chip to realize integrated encapsulation. At the same time, the experimental test platform is designed to study the key parameters that affect the performance of the ion wind generator, especially the shape of the emission electrode and the shape of the collecting electrode. The effect of electrode spacing and working voltage on the ion wind generator was studied. An array of ion wind generating devices was designed for a high heat flux LED chip with a heat dissipation surface size of 40mm 脳 40mm. Then we design the ion wind heat dissipation system which can meet the demand of LED chip. At the same time, we design the contrast experiment, compare and analyze the heat dissipation effect of ion wind cooling system and traditional forced air cooling heat dissipation system. The specific research contents and conclusions are as follows: 1. Using copper as the material of emission electrode and collecting electrode, the copper plate with 0.1mm thickness was processed by laser processing equipment, and the ion wind generating device was made through the later assembly. A single variable method was used to study the influence factors such as mesh size, needle emission electrode diameter and electrode spacing. The results showed that the grid size of the collecting electrode was 1.0mm 脳 1.0 mm, the diameter of the emission electrode was 0.122 mm, and so on. The electrode spacing of 5mm is the optimal structural parameter, and the maximum wind speed is 2.45 m / s. 2. An experimental platform for measuring the performance of ion wind generator array is designed. By controlling a single variable, the longitudinal and transverse spacing of ion wind generator array is calculated. The experimental results show that the optimized longitudinal distance is 6 mm, the optimal transverse distance is 2.64 mm, and the optimum angle between the collecting electrode and the heat dissipation surface is 30 擄. The realized minimum temperature is 50.29 擄C. 3. The effects of different heat flux and working voltage on the performance of LED ion cooling system were studied, and a comparative experiment was designed to analyze the effect of ion air cooling system and traditional forced air cooling system. The experimental results show that under the heat flux of 0.3752cm W, the heat dissipation effect of the system is the best, and the highest convection heat transfer coefficient can reach to 75.56W/ (3?). When the working voltage is 4.2 kV, the heat dissipation effect of the system is good, and the highest convection heat transfer coefficient can reach 66.71W/ (3?). When the power consumption is 0-0.026W, the ion wind heat dissipation system has the absolute advantage and the highest convection heat transfer coefficient can reach 51.30W/ (3?). This paper provides a new idea for the design and structure optimization of LED ion cooling system with high heat flux. The research on heat transfer characteristics and application of ion wind cooling system enriches the application system of LED chip thermal management. It provides a new scheme for heat design of high heat flux chip represented by LED chip.
【學(xué)位授予單位】：廣東工業(yè)大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號】：TN312.8
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