發(fā)布時間：2019-05-10 02:28

【摘要】：現(xiàn)代電子產(chǎn)品功能多、體積小、結(jié)構(gòu)緊湊,使得電子設備在有限的體積范圍內(nèi),功率密度不斷增加,熱流密度迅速提高,導致電子設備的工作溫度急劇上升,故障發(fā)生率也越來越頻繁。因此,為保證電子設備在相應的工作環(huán)境下,長期、可靠、穩(wěn)定工作,熱設計是必須要考慮的關鍵點之一。本文以某軍用密閉式通信電子設備機箱散熱器的熱設計為例,使用Ansys熱分析軟件中的Icepak模塊進行建模并求解,得出其分別在20℃、30℃、60℃等惡劣環(huán)境條件下的溫度分布情況;利用正交試驗的分析方法得到了影響設備散熱的主次要因素,并通過對多種優(yōu)化結(jié)構(gòu)模型的熱分析,確定了散熱器翅片結(jié)構(gòu)尺寸的最優(yōu)方案;通過對工程樣機的溫度場實際測試進一步驗證熱設計的正確性。綜上所述,通過熱分析軟件來模擬設備內(nèi)部溫度場的分布情況,有效縮短了研制周期,在保證設備能夠正常、穩(wěn)定、可靠使用的前提下,對降低生產(chǎn)成本有一定幫助。
[Abstract]:The modern electronic products have many functions, small size and compact structure, which make the electronic equipment in the limited volume range, the power density increases constantly, the heat flux density increases rapidly, which leads to the sharp rise of the working temperature of the electronic equipment. The incidence of faults is also becoming more and more frequent. Therefore, in order to ensure the long-term, reliable and stable work of electronic equipment in the corresponding working environment, thermal design is one of the key points that must be considered. Taking the thermal design of a military closed communication electronic equipment case radiator as an example, this paper uses the Icepak module of Ansys thermal analysis software to model and solve the heat sink, and it is obtained that the heat sink is at 20 鈩，

本文編號：2473274